The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Aug. 03, 2016
Applicant:
Air Products and Chemicals, Inc., Allentown, PA (US);
Inventors:
Randy Li-Kai Chang, Pingzhen, TW;
Gene Everad Parris, Coopersburg, PA (US);
Hsiu Mei Chen, Taoyuan, TW;
Yi-Chia Lee, Chupei, TW;
Wen Dar Liu, Chupei, TW;
Tianniu Chen, Westford, MA (US);
Laura M. Matz, Allentown, PA (US);
Ryback Li Chang Lo, Chupei, TW;
Ling-Jen Meng, Taipei, TW;
Assignee:
VERSUM MATERIALS US, LLC, Tempe, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 11/00 (2006.01); H01L 23/00 (2006.01); C11D 7/26 (2006.01); C11D 7/34 (2006.01); C11D 7/50 (2006.01); C11D 7/32 (2006.01); C11D 3/00 (2006.01); G03F 7/42 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
C11D 11/0047 (2013.01); C11D 3/0073 (2013.01); C11D 7/265 (2013.01); C11D 7/3209 (2013.01); C11D 7/34 (2013.01); C11D 7/5009 (2013.01); C11D 7/5013 (2013.01); C11D 7/5022 (2013.01); G03F 7/425 (2013.01); G03F 7/426 (2013.01); H01L 21/31133 (2013.01); H01L 24/02 (2013.01); H01L 24/11 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/94 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05171 (2013.01); H01L 2224/05614 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05671 (2013.01); H01L 2224/05672 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/1148 (2013.01); H01L 2224/1181 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/94 (2013.01);
Abstract
It is disclosed a photoresist cleaning composition for stripping a photoresist pattern having a film thickness of 3-150 μm, which contains (a) quaternary ammonium hydroxide (b) a mixture of water-soluble organic solvents (c) at least one corrosion inhibitor and (d) water, and a method for treating a substrate therewith.