The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Dec. 04, 2012
Tokyo Electron Limited, Tokyo, JP;
Intel Corporation, Santa Clara, CA (US);
Osamu Hirakawa, Koshi, JP;
Masaru Honda, Koshi, JP;
Akira Fukutomi, Koshi, JP;
Takeshi Tamura, Koshi, JP;
Jiro Harada, Koshi, JP;
Kazutaka Noda, Kikuchi, JP;
Xavier Francois Brun, Chandler, AZ (US);
Tokyo Electron Limited, Tokyo, JP;
INTEL CORPORATION, Santa Clara, CA (US);
Abstract
A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate, includes: a first holding unit which holds the processing target substrate; a second holding unit which holds the supporting substrate; a moving mechanism which relatively moves the first holding unit or the second holding unit in a horizontal direction; a load measurement unit which measures a load acting on the processing target substrate and the supporting substrate when the processing target substrate and the supporting substrate are separated; and a control unit which controls the moving mechanism based on the load measured by the load measurement unit.