The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Dec. 09, 2015
Tokyo Electron Limited, Tokyo, JP;
Takafumi Hasimoto, Koshi, JP;
Shinichi Hatakeyama, Koshi, JP;
Naoki Shibata, Koshi, JP;
Kousuke Yoshihara, Koshi, JP;
Minoru Kubota, Koshi, JP;
Hiroyuki Ide, Koshi, JP;
Tokyo Electron Limited, Minato-Ku, JP;
Abstract
There is provided a coating method which can apply a coating solution uniformly onto a substrate surface while reducing the amount of the coating solution supplied. The coating method for applying a coating solution onto a wafer includes the steps of: supplying a solvent for the coating solution onto the wafer to form an annular liquid film of the solvent in a peripheral area of the wafer; supplying the coating solution to the center of the wafer while rotating the wafer at a first rotational speed (time t-t); and allowing the coating solution to spread on the wafer by rotating the wafer at a second rotational speed which is higher than the first rotational speed (time t-t). The supply of the solvent is continued until just before the coating solution comes into contact with the liquid film of the solvent (time t-t).