The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2018
Filed:
Feb. 04, 2016
Infineon Technologies Austria Ag, Villach, AT;
Ralf Otremba, Kaufbeuren, DE;
Chooi Mei Chong, Melaka, MY;
Raynold Talavera Corocotchia, Melaka, MY;
Teck Sim Lee, Melaka, MY;
Sanjay Kumar Murugan, Malacca, MY;
Klaus Schiess, Allensbach, DE;
Chee Voon Tan, Seremban, MY;
Wee Boon Tay, Melaka, MY;
Infineon Technologies Austria AG, Villach, AT;
Abstract
A semiconductor chip package includes a semiconductor chip, an encapsulation body encapsulating the semiconductor chip, a chip pad, and electrical contact elements connected with the semiconductor chip and extending outwardly. The encapsulation body has six side faces and the electrical contact elements extend exclusively through two opposing side faces which have the smallest surface areas from all the side faces. The semiconductor chip is disposed on the chip pad, and a main face of the chip pad remote from the semiconductor chip is at least partially exposed to the outside.