Malacca, Malaysia

Raynold Talavera Corocotchia

This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Austria Ag. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Raynold Talavera Corocotchia. Retrieved from https://idiyas.com/inventor/raynold-talavera-corocotchia

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: The Innovations of Raynold Talavera Corocotchia

Introduction: Raynold Talavera Corocotchia is an accomplished inventor based in Melaka, Malaysia. With his innovative contributions to the field of semiconductor technology, he has made a significant impact in the industry. His work emphasizes the importance of efficient design in electronic components, showcasing the potential for advancements in this ever-evolving field.

Latest Patents: Raynold holds a patent for a novel semiconductor chip package design, titled "Semiconductor chip package having contact pins at short side edges." This innovative package includes a semiconductor chip that is encapsulated within a body. The design features electrical contact elements that extend outwardly through two opposing side faces, which are notable for having the smallest surface areas among the six side faces of the encapsulation body. This configuration not only enhances the chip's functionality but also optimizes space, making it a valuable addition to semiconductor applications.

Career Highlights: Raynold is currently employed at Infineon Technologies Austria AG, a leading global player in semiconductor solutions. His role involves pushing the boundaries of technology and driving the development of cutting-edge semiconductor products that meet the demands of the modern market. With a strong engineering background, Raynold's expertise plays a critical role in the continued success and innovation at the company.

Collaborations: Throughout his career, Raynold has worked alongside talented professionals such as Ralf Otremba and Chooi Mei Chong. These collaborations have fostered a creative and innovative environment, allowing them to collectively enhance their semiconductor technologies while sharing insights and expertise in various projects.

Conclusion: Raynold Talavera Corocotchia exemplifies the spirit of innovation in the field of semiconductor technology. His patent for the semiconductor chip package highlights the significance of practical design in enhancing electronic functionalities. As he continues his work at Infineon Technologies Austria AG, Raynold remains a key figure in the pursuit of technological advancement, inspiring future inventors and innovators in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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