The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2018
Filed:
Dec. 09, 2015
Intel Corporation, Santa Clara, CA (US);
Bok Eng Cheah, Bayan Lepas, MY;
Jackson Chung Peng Kong, Tanjung Tokong, MY;
Kooi Chi Ooi, Glugor, MY;
Mark A. Schaecher, Phoenix, AZ (US);
Teong Guan Yew, Bagan Serai, MY;
Eng Huat Goh, Ayer Itam, MY;
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods, systems, and apparatuses for a foldable fabric-based semiconductor package (FFP) that can assist with charging a secondary cell are described. An FFP includes: a ground plane; a first component over the ground plane; a second component adjacent to the ground plane; a third component adjacent to the second component; a molding compound encapsulating the ground plane, the first component, the second component, and the third component; a first fabric layer on a top side of the molding compound; and a second fabric layer on a bottom side of the molding compound. Each of the first, second, and third components includes one or more semiconductor dies. The third component is electrically coupled to each of the first and second components. The first and second components can wireless charge the secondary cell. The third component can power the first and second components. The ground plane can protect against electromagnetic signals.