The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Mar. 31, 2016
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Keith Wells, Santa Cruz, CA (US);

Xiaochun Li, San Jose, CA (US);

Lisheng Gao, Morgan Hill, CA (US);

Tao Luo, Fremont, CA (US);

Markus Huber, Oakland, CA (US);

Assignee:

KLA-Tencor Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); G06T 7/00 (2017.01); H01L 21/67 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G06T 7/001 (2013.01); G06T 7/0006 (2013.01); G06T 7/0008 (2013.01); H01L 21/67288 (2013.01); H01L 22/12 (2013.01); G01N 2201/061 (2013.01); G01N 2201/068 (2013.01); G01N 2201/06113 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by the optical inspection subsystem for the design printed on the wafer. The computer subsystem(s) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.


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