Gilbert, AZ, United States of America

Zong-Fu Li


Average Co-Inventor Count = 1.9

ph-index = 10

Forward Citations = 375(Granted Patents)


Company Filing History:


Years Active: 1999-2007

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22 patents (USPTO):Explore Patents

Title: Innovations of Zong-Fu Li: Advancements in Integrated Circuit Packaging

Introduction

Zong-Fu Li is a prominent inventor based in Gilbert, Arizona, recognized for his significant contributions to the field of integrated circuit packaging. With a total of 22 patents to his name, Li has demonstrated remarkable innovation and expertise, especially in the design and functionality of electronic components.

Latest Patents

Among his latest inventions are two notable patents titled "Windowed package having embedded frame." This innovation presents an integrated circuit (IC) package that includes a mold compound, a die, and a window. The mold compound features a frame embedded within it, which has a top surface, a bottom surface, and a top-to-bottom opening. The die is affixed to the mold compound, positioning the embedded frame beneath the die's periphery. Importantly, the window is attached to the mold compound above the die, enabling light to reach the die effectively.

Career Highlights

Zong-Fu Li is currently associated with Intel Corporation, a global leader in technology and semiconductor manufacturing. Throughout his career at Intel, he has focused on pushing the boundaries of integrated circuit design, resulting in numerous patents that enhance the performance and efficiency of electronic devices.

Collaborations

Li has collaborated with several esteemed colleagues in his workplace, including Edward John Bawolek and Kabul S Sengupta. Together, they contribute to the innovative culture at Intel, driving advancements in technology and fostering a collaborative environment that promotes cutting-edge research and development.

Conclusion

Zong-Fu Li's work not only exemplifies the spirit of innovation but also significantly impacts the future of integrated circuit technology. His extensive patent portfolio highlights his dedication to improving electronic design, making him a valuable asset to Intel Corporation and the industry at large. Through his inventions, he continues to pave the way for future advancements in electronics.

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