Intel Corporation

Zong-Fu Li

Edward John Bawolek

Kabul S Sengupta

Deborah L Thompson

Cory E Weber

Gregory W Starr

Shaofeng Yu

Mark A Beiley

Kevin M Connolly

James E Breisch

Akira Kakizawa

Jung S Kang

Berni W Landau

Curtis A Corum

Joseph W Parks, Jr

Ronald Dean Smith

An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.

Windowed package having embedded frame

A color imaging device comprised of a plurality of light selective elements. The light selective elements include a first light selective element selective to light having a wavelength corresponding to the Orange region of the spectrum, a second light selective element selective to light having a wavelength corresponding to the Green region of the spectrum, and a third light selective element sensitive to light having a wavelength corresponding to the Blue region of the spectrum.

Orange-green-blue (OGB) color system for digital image sensor applications

An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.

Windowed non-ceramic package having embedded frame

By forming a microlens of negative photoresist, economical microlens fabrication processes may be used which, in some embodiments, may achieve microlenses having good optical clarity and high thermal stability. In one embodiment, a positive photoresist may be used as a pattern mask to transfer a pattern to the negative photoresist. The microlenses may be formed by dry etching the positive photoresist which acts as a mask to transfer a pattern to the underlying negative photoresist. At the same time a scratch protection layer may be formed over regions not overlying optical sensors.

Microlens formed of negative photoresist

An image sensing device including an imaging sensor, a package having opposing side portions, and an infrared light selective element coupled to the opposing side portions and overlying a top side portion of the imaging sensor, the selective element including a plastic element and a dye.

Plastic light selective element for imaging applications

A method of forming a microlens including, in one aspect, depositing a substantially non-photo-imageable microlens material over an area of a chip, a portion of which contains an array of photosensitive circuits, and patterning the microlens material over the array of photosensitive circuits to define a microlens over each photosensitive circuit.

Microlens array

An apparatus and method for enabling interaction between electronic circuitry and optical signals with a package for enclosing the electronic circuitry having contacts and a window for the passage of optical signals disposed about a face of the package that becomes substantially inaccessible when the package is used.

Windowed package for electronic circuitry

The making and use of color microlenses in color image sensors and color display devices is described and claimed. The color microlenses combine the function of a colorless microlens and a color filter into a single structure simplifying the fabrication of, and increasing the reliability of display devices and image sensors using the described color microlenses.

Method for creating a color microlens array of a color display layer

A liquid crystal color filter may include an infrared blocking. dye integrated within the filter to prevent infrared radiation from adversely affecting the performance of the filter when used in an imaging system. The dye may be incorporated into a liquid crystal element in the filter or may be coated on components thereof. Suitable dyes are transmissive of light in the visible range and substantially absorbent of light in the infrared range from approximately 800 nm to 1200 nm in wavelength.

Liquid crystal color filter with integrated infrared blocking

Leakage current may be reduced in trench isolated semiconductor devices by providing a buffer between the trench isolation and an active area. For example, with a trench isolated photodiode, a buffer of opposite conductivity type may be provided between the trench and the diffusion that forms the p-n junction of the photodiode.

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Gilbert, AZ, United States of America

Zong-Fu Li