This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Grand Process Technology Corporation. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Zong-En Wu: Innovator in Wafer Processing Technology
Introduction
Zong-En Wu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor processing, particularly in the area of wafer debonding and cleaning technologies. His innovative approach has led to the development of a unique apparatus that streamlines the processing of wafers.
Latest Patents
Zong-En Wu holds a patent for an "Integrated wafer debonding and cleaning apparatus and debonding and cleaning method." This invention encompasses an integrated system that includes an input port, a debonding module, a wafer cleaning device, and a transport device. The design allows for the efficient processing of substrates, which consist of a bonded wafer and carrier. The debonding module effectively separates the wafer from the carrier, while the cleaning apparatus ensures the wafer is thoroughly cleaned. This integrated approach facilitates continuous processing, enhancing productivity in semiconductor manufacturing.
Career Highlights
Zong-En Wu is associated with Grand Process Technology Corporation, where he applies his expertise in wafer processing technologies. His work has been instrumental in advancing the capabilities of the company in the semiconductor industry. His innovative solutions have positioned him as a key figure in the development of efficient manufacturing processes.
Collaborations
Zong-En Wu collaborates with talented individuals such as Chih-Cheng Wang and Yun-Cheng Chiu. Their combined efforts contribute to the advancement of technologies in the semiconductor field, fostering innovation and efficiency.
Conclusion
Zong-En Wu's contributions to wafer processing technology exemplify the impact of innovation in the semiconductor industry. His patented apparatus not only enhances the efficiency of wafer debonding and cleaning but also reflects his commitment to advancing manufacturing processes. His work continues to influence the field and inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile