The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
Feb. 02, 2023
Grand Process Technology Corporation, Hsinchu, TW;
GRAND PROCESS TECHNOLOGY CORPORATION, Hsinchu, TW;
Abstract
An integrated wafer debonding and cleaning apparatus and a debonding and cleaning method are provided. The integrated wafer debonding and cleaning apparatus includes an input port, a debonding module, a wafer cleaning device, and a transport device. The input port is configured to allow a substrate to be processed to enter the integrated wafer debonding and cleaning apparatus. The substrate to be processed includes a wafer and a carrier which are bonded. The debonding module is configured to debond the substrate to be processed, and to separate the wafer from the carrier. The wafer cleaning apparatus is configured to clean the wafer. The transport device is configured to transfer the substrate to be processed, the wafer, and the carrier. The debonding module and the wafer cleaning module are integrated in one apparatus for continuous processing.