Chengdu, China

Zi Qi Wang

This inventor holds 3 USPTO granted patents and 5 published patent applications. Top assignee: Texas Instruments Corporation. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zi Qi Wang. Retrieved from https://idiyas.com/inventor/zi-qi-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 5.6

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Chengdu Sichuan, CN (2019)
  • Chengdu, CN (2020)

Company Filing History:


Years Active: 2019-2026

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3 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Zi Qi Wang

Introduction

Zi Qi Wang is a notable inventor based in Chengdu, China. He has made significant contributions to the field of semiconductor technology, holding 3 patents that showcase his expertise and innovative spirit. His work primarily focuses on methods for improving the efficiency and effectiveness of semiconductor devices.

Latest Patents

Zi Qi Wang's latest patents include groundbreaking methods for ball bond attachment and wire ball bonding in semiconductor devices. The first patent, titled "Ball bond attachment for a semiconductor die," describes a method for forming a ball bond for an integrated circuit on a semiconductor die. This method involves forming a ball at the end of a conductive wire and lowering a capillary tool toward a pad on the semiconductor die. The innovative aspect of this method is that it allows for bonding without the use of ultrasound, enhancing the bonding process's efficiency.

The second patent, "Wire ball bonding in semiconductor devices," presents a method for interconnecting components of a semiconductor device using wire bonding. This method includes creating a free air ball at the end of an aluminum wire coated with palladium. The free air ball is bonded to a bond pad on a semiconductor chip, resulting in a strong aluminum-to-aluminum bond. This patent also details the bonding of a second end of the coated-aluminum wire to a separate bond site, forming a palladium-to-palladium bond.

Career Highlights

Zi Qi Wang is currently employed at Texas Instruments Corporation, where he continues to innovate and contribute to the semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor devices, making them more reliable and efficient.

Collaborations

Zi Qi Wang has collaborated with talented coworkers, including Han Zhong and Yong Qiang Tang. These collaborations have fostered a creative environment that encourages the development of innovative solutions in semiconductor technology.

Conclusion

Zi Qi Wang's contributions to the field of semiconductor technology through his patents and work at Texas Instruments Corporation highlight his role as a leading inventor. His innovative methods for bonding in semiconductor devices are paving the way for advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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