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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10692835 B1

PDFFull Text
Date of Patent:
Jun. 23, 2020

Filed:

Oct. 25, 2018

Ball bond attachment for a semiconductor die

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Han Zhong, Chengdu, CN;

Zi Qi Wang, Chengdu, CN;

Chen Xiong, Chengdu, CN;

Yong Qiang Tang, Chengdu, CN;

Xi Lin Li, Chengdu, CN;

Xiao Lin Kang, Chengdu, CN;

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Dawn Jos

Charles A. Brill

Frank D. Cimino

Primary Examiner:

Vu A Vu

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 24/78 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/78804 (2013.01); H01L 2224/85201 (2013.01);
Abstract

A method for forming a ball bond for an integrated circuit formed on a semiconductor die includes forming a ball at a first send of a conductive wire inserted in a capillary tool and lowering the capillary tool toward a pad on the semiconductor die positioned on a support surface. The method further includes moving, using a motor, the support surface relative to the capillary tool to thereby bond the ball, without using ultrasound, to the pad and then raising the capillary tool.

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Zhong, Han. (2020). Ball bond attachment for a semiconductor die (U.S. Patent No. 10692835). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10692835

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