Singapore, Singapore

Zhou Wei

This inventor holds 9 USPTO granted patents. Top assignee: Micron Technology Incorporated. Active years: 2004-2014.


% Patents Active = 77.8

Average Co-Inventor Count = 7.2

ph-index = 5

Forward Citations = 157(Granted Patents)


Company Filing History:


Years Active: 2004-2014

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9 patents (USPTO):Explore Patents

Title: Zhou Wei: Innovator in Microelectronic Packaging

Introduction

Zhou Wei is a prominent inventor based in Singapore, known for his significant contributions to the field of microelectronic packaging. With a total of 9 patents to his name, he has made remarkable advancements that enhance the functionality and efficiency of microelectronic components.

Latest Patents

Zhou Wei's latest patents include innovative designs for packaged microelectronic components with terminals exposed through encapsulant. This design allows for a plurality of electrical leads to be coupled to a microelectronic component, with exposed lengths extending outwardly beyond the encapsulant's peripheral edge. This configuration facilitates the connection of the microelectronic component to a substrate using the leads as a conventional leaded package. Additionally, the terminals enable stacking of the leaded package with other microelectronic components, such as BGA packages. Another notable patent involves castellation wafer level packaging of integrated circuit chips. This method couples the active circuit areas of chips to castellation blocks and input/output pads, which are encapsulated and held in place by an encapsulant. The packages can be utilized as leadless chip carrier packages or stacked on top of one another, allowing for efficient data transfer when activated.

Career Highlights

Zhou Wei is currently employed at Micron Technology Incorporated, where he continues to innovate in the field of microelectronics. His work has significantly impacted the design and functionality of microelectronic components, making them more versatile and efficient.

Collaborations

Zhou Wei collaborates with talented coworkers, including Chia Yong Poo and Low Siu Waf, to further enhance the development of microelectronic technologies.

Conclusion

Zhou Wei's contributions to microelectronic packaging demonstrate his expertise and commitment to innovation in the field. His patents not only reflect his ingenuity but also pave the way for future advancements in microelectronics.

Profile summary based on public USPTO records.
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