San Diego, CA, United States of America

Zhongping Bao

USPTO Granted Patents = 8 

Average Co-Inventor Count = 3.5

ph-index = 5

Forward Citations = 146(Granted Patents)


Company Filing History:


Years Active: 2013-2016

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8 patents (USPTO):

Title: Inventor Profile: Zhongping Bao

Introduction

Zhongping Bao is a distinguished inventor based in San Diego, California, who has made significant contributions to the field of integrated circuit packaging. With a total of 8 patents to his name, Bao is known for his innovative approaches in semiconductor technologies.

Latest Patents

Among his latest contributions, Bao's innovative designs enhance the reliability and efficiency of multi-chip integrated circuits. One notable patent, titled "Stacked Multi-Chip Integrated Circuit Package," presents an advanced solution that protects against warpage failures in IC packages. This invention incorporates a substrate, a level-one IC die, and multiple level-two IC dies, strategically arranged to mitigate potential issues such as cracking and peeling.

Another vital patent is related to "Crack Stopping Structure in Wafer Level Packaging (WLP)." This invention outlines a semiconductor device featuring a substrate and integrated crack stopping structures designed to prevent damage in critical areas of the device. These structures enhance the durability of semiconductor devices by providing strategic reinforcement around bump and pad areas.

Career Highlights

Zhongping Bao is currently employed at Qualcomm Incorporated, a leader in semiconductor technology, which further underscores his role in advancing innovative solutions in the industry. His expertise and inventive spirit have established him as a prominent figure in the semiconductor field.

Collaborations

Throughout his career, Bao has collaborated with talented individuals, including esteemed coworkers like James D. Burrell and Dongming He. These collaborations have fostered an environment of innovation and excellence, contributing to the successful development of cutting-edge technologies in integrated circuit design.

Conclusion

Zhongping Bao's inventive work in creating sophisticated solutions in integrated circuit packaging is a testament to his dedication to innovation. With his impressive portfolio of patents and his commitment to advancing semiconductor technologies, Bao continues to be a significant influence in the field. His contributions lay the groundwork for future advancements, ensuring the continued evolution of integrated circuit technologies.

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