The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Mar. 05, 2013
Qualcomm Incorporated, San Diego, CA (US);
Yue Li, San Diegoc, CA (US);
Xiaoming Chen, San Diego, CA (US);
Zhongping Bao, San Diego, CA (US);
Charles D. Paynter, San Diego, CA (US);
Xiaonan Zhang, San Diego, CA (US);
Ryan D. Lane, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
Some implementations provide a semiconductor device that includes a first substrate, a die coupled to the first substrate, and a set of solder balls coupled to the first substrate. The set of solder balls is configured to provide an electrical connection between the die and a second substrate. The semiconductor device also includes at least one decoupling capacitor coupled to the die through the first substrate. The at least one decoupling capacitor is configured to provide an electrical connection between the die and the second substrate. The at least one decoupling capacitor is coupled to the first substrate such that the at least one decoupling capacitor is positioned between the first substrate and the second substrate. In some implementations, the second substrate is a printed circuit board (PCB). In some implementations, the first substrate is a first package substrate, and the second substrate is a second package substrate.