Zhongbo Yan

Title: Innovations by Zhongbo Yan in Molybdenum Filling Techniques

Introduction

Zhongbo Yan is an accomplished inventor based in Newark, CA (US). He has made significant contributions to the field of materials science, particularly in the area of semiconductor manufacturing. His innovative approaches have led to advancements in the methods of filling features with molybdenum.

Latest Patents

Zhongbo Yan holds a patent for a method titled "Molybdenum fill." This patent describes embodiments of methods for filling features with molybdenum (Mo). The process includes depositing a first layer of Mo in a feature that has an opening and an interior. The first layer is treated non-conformally, allowing regions near the opening to be preferentially treated over regions in the interior. In some embodiments, a second Mo layer is deposited on the treated first layer. The methods also involve controlling Mo precursor flux to transition between conformal and non-conformal fill.

Career Highlights

Zhongbo Yan is currently employed at Lam Research Corporation, a leading company in semiconductor equipment manufacturing. His work at Lam Research has positioned him as a key player in the development of advanced materials and processes that enhance semiconductor fabrication.

Collaborations

Zhongbo Yan has collaborated with notable colleagues, including Lawrence Schloss and Shruti Vivek Thombare. These collaborations have fostered a productive environment for innovation and have contributed to the success of their projects.

Conclusion

Zhongbo Yan's contributions to the field of molybdenum filling techniques exemplify the importance of innovation in semiconductor manufacturing. His patent and work at Lam Research Corporation highlight his role as a significant inventor in this critical industry.