This inventor holds 1 USPTO granted patent. Top assignee: Anhui Agricultural University. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Zhong Wang and a Tougher Branched Polyamide Copolymer
Introduction
Zhong Wang is an inventor associated with Anhui Agricultural University in Hefei, China. His listed patent concerns a preparation method for a branched polyamide copolymer designed to deliver ultra-high toughness.
Latest Patents
Wang’s listed patent, “Preparation method of branched polyamide (PA) copolymer with ultra-high toughness, PA copolymer prepared using the method, and use of the PA copolymer,” describes a process for producing a branched copolymer through melt polycondensation.
The method prepares separate solutions of a linear dibasic acid and two diamines. One diamine is combined with the acid solution to form an amide salt solution, while the other is used to produce a precipitated amide salt. The two products are then mixed with a catalyst and subjected to melt polycondensation. The resulting copolymer is described as having strong mechanical performance and potential applications in melt blending for toughening, melt-extrusion spinning, blow-extruded films, and hot-melt adhesives. Wang is credited with 1 patent in the information provided.
Career Highlights
The available information identifies Wang’s connection with Anhui Agricultural University and highlights his work on polymer preparation and materials performance. The patent focuses on a process intended to produce a tough branched polyamide copolymer for use in manufacturing and materials applications.
Collaborations
Zhongkai Wang and Wei Liu are listed as Wang’s coworkers. The provided information does not specify their roles in the patent or describe the nature of their collaboration.
Conclusion
Zhong Wang’s listed patent presents a melt-polycondensation approach to preparing a branched polyamide copolymer with potential uses across several industrial materials applications.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile