This inventor holds 1 USPTO granted patent. Top assignee: Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Zhigang Pan and His Semiconductor Packaging Invention.
Introduction
Zhigang Pan is an inventor associated with Wuhan, China, and Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. His listed patent concerns chip packaging, an important area of semiconductor manufacturing focused on connecting and protecting chip components.
Latest Patents
Pan is credited with 1 patent: “Chip Packaging Method and Chip Packaging Structure.” The invention describes bonding an encapsulated chip grain to a packaging substrate using aligned medium-to-medium and metal-to-metal hybrid bonding. The substrate has a hybrid bonding structure on its front side and a connection pin on its back side, electrically linked through a metal column that passes through the substrate. This arrangement provides an integrated connection between the chip and the substrate.
Career Highlights
The available information associates Pan with Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. His listed patent reflects work on packaging structures and bonding techniques for semiconductor devices.
Collaborations
Ning Wang and Xiaoqin Sun are identified as Pan’s coworkers. The available details do not specify their roles in the patent or whether they collaborated on this invention.
Conclusion
Zhigang Pan’s listed invention addresses semiconductor chip packaging through hybrid bonding and substrate interconnection, highlighting his contribution to this area of semiconductor technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile