Shanghai, China

Zhi Rong Guo

This inventor holds 1 USPTO granted patent. Top assignee: Semiconductor Manufacturing International (Shanghai) Corporation. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhi Rong Guo. Retrieved from https://idiyas.com/inventor/zhi-rong-guo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Zhi Rong Guo: Innovator in Integrated Circuit Packaging

Introduction

Zhi Rong Guo is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of integrated circuit packaging. His innovative work has led to the development of a unique patent that addresses critical challenges in the industry.

Latest Patents

Zhi Rong Guo holds a patent for a "Multipurpose decapsulation holder and method for a ball grid array package." This invention provides a method and apparatus for the decapsulation of integrated circuit packages. The apparatus includes a support member with an open region and an adjustable device. This adjustable device can hold a BGA package in a way that allows a surface region to face a decapsulation source while keeping the balls on the BGA package safe from damage.

Career Highlights

Zhi Rong Guo is currently employed at Semiconductor Manufacturing International (Shanghai) Corporation. His work focuses on enhancing the efficiency and safety of integrated circuit packaging processes. With his innovative approach, he has contributed to advancements in semiconductor technology.

Collaborations

Some of Zhi Rong Guo's notable coworkers include Chun Kui Ji and Shan An Liang. Their collaborative efforts have further propelled advancements in the field of semiconductor manufacturing.

Conclusion

Zhi Rong Guo's contributions to integrated circuit packaging through his innovative patent demonstrate his expertise and commitment to advancing technology. His work continues to influence the semiconductor industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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