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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7772030 B1

PDFFull Text
Date of Patent:
Aug. 10, 2010

Filed:

Dec. 23, 2006

Multipurpose decapsulation holder and method for a ball grid array package

Applicants:

Chun Kui Ji, Shanghai, CN;

Shan an Liang, Shanghai, CN;

Zhi Rong Guo, Shanghai, CN;

Min Pan, Shanghai, CN;

Inventors:

Chun Kui Ji, Shanghai, CN;

Shan An Liang, Shanghai, CN;

Zhi Rong Guo, Shanghai, CN;

Min Pan, Shanghai, CN;

Assignee:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Attorney:

Townsend and Townsend and Crew LLP

Primary Examiner:

Ha Tran T Nguyen

Assistant Examiner:

Valerie Brown

Int. Cl.
CPC ...
H01L 21/00 (2006.01); B26D 5/00 (2006.01); B29C 65/00 (2006.01); B32B 37/00 (2006.01); B32B 41/00 (2006.01); B65C 9/40 (2006.01); G05G 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and apparatus for the decapsulation of integrated circuit packages. The apparatus includes a support member, the support member having an open region and an adjustable device coupled to the support member. The adjustable device can be adapted to hold a BGA package such that a surface region of the BGA package is spatially disposed to face a decapsulation source and a plurality of balls on the BGA package remain free from contact from the decapsulation source and free from contact from a thermal source capable of causing damage to one or more of the balls. The decapsulation source is provided to subject a portion of the surface region of the BGA package for removal of the portion of the BGA package.

Find Patent Forward Citations

Ji, Chun. (2010). Multipurpose decapsulation holder and method for a ball grid array package (U.S. Patent No. 7772030). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7772030

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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