This inventor holds 3 USPTO granted patents. Top assignee: Semiconductor Manufacturing International (Shanghai) Corporation. Active years: 2009-2011.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2009-2011
Title: Innovations by Chun Kui Ji in BGA Package Technology
Introduction
Chun Kui Ji is a notable inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology, particularly in the development of devices and methods for testing ball grid array (BGA) packages. With a total of 3 patents to his name, his work has had a considerable impact on the industry.
Latest Patents
Chun Kui Ji's latest patents include innovative solutions for BGA package testing. One of his patents is a "BGA package holder device and method for testing of BGA packages." This apparatus supports BGA packages during testing processes and features a substrate member with multiple contact pads. Each contact pad is strategically placed around the substrate's peripheral region, allowing for effective electrical contact with the BGA package's balls.
Another significant patent is the "Multipurpose decapsulation holder and method for a ball grid array package." This invention provides a method and apparatus for decapsulating integrated circuit packages. The design includes a support member with an open region and an adjustable device that holds the BGA package in a position that protects its balls from damage during the decapsulation process.
Career Highlights
Chun Kui Ji is currently employed at Semiconductor Manufacturing International Corporation, a leading company in the semiconductor industry. His work focuses on enhancing the efficiency and reliability of BGA packages, which are crucial components in modern electronic devices.
Collaborations
Chun Kui Ji has collaborated with several talented individuals in his field, including Shan An Liang and Ping Lung Liao. Their combined expertise has contributed to the advancement of semiconductor technologies and innovations.
Conclusion
Chun Kui Ji's contributions to BGA package technology demonstrate his commitment to innovation in the semiconductor industry. His patents reflect a deep understanding of the challenges faced in testing and decapsulating integrated circuit packages. Through his work, he continues to influence the future of semiconductor manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile