Tainan, Taiwan

Zhi Jian Wang

USPTO Granted Patents = 1 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovations of Zhi Jian Wang

Introduction

Zhi Jian Wang is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology. His work focuses on enhancing interconnect structures, which are crucial for the performance of integrated circuits.

Latest Patents

Zhi Jian Wang holds a patent for a "Multiple-level interconnect structure and manufacturing method thereof." This innovative patent provides a multiple-level interconnect structure that includes a scatterometry test layer. The structure consists of a patterned reflective layer, a bulk reflective layer, and a patterned test layer. The patterned reflective layer is situated on a substrate and features a first reflective pattern and a second reflective pattern that are separated from each other. The bulk reflective layer is positioned on the patterned reflective layer, while the patterned test layer is placed on the bulk reflective layer. This invention aims to improve the efficiency and reliability of semiconductor devices.

Career Highlights

Zhi Jian Wang is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His role involves research and development, where he applies his expertise to create advanced technologies that drive innovation in the field.

Collaborations

Throughout his career, Zhi Jian Wang has collaborated with talented individuals such as Jia Fang Wu and Hsiang-Chieh Yen. These collaborations have contributed to the advancement of semiconductor technologies and have fostered a culture of innovation within their team.

Conclusion

Zhi Jian Wang's contributions to the field of semiconductor technology, particularly through his patent on multiple-level interconnect structures, highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future innovations.

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