Company Filing History:
Years Active: 2001
Title: Zhenfeng Guo: Innovator in Lead-Free Solder Technology
Introduction
Zhenfeng Guo is a notable inventor based in Solon, OH (US). He has made significant contributions to the field of materials science, particularly in the development of lead-free solder alloys. His innovative work addresses the growing need for environmentally friendly alternatives in electronic manufacturing.
Latest Patents
Zhenfeng Guo holds a patent for a high strength, high fatigue resistance, and high wetting lead-free solder alloy. This alloy comprises effective amounts of tin, copper, silver, bismuth, indium, and antimony, with a melting temperature between 175-215°C. This invention is crucial for enhancing the reliability and performance of electronic components.
Career Highlights
Guo is currently associated with H-Technologies Group, Incorporated, where he continues to push the boundaries of solder technology. His work has been instrumental in advancing the industry towards safer and more efficient materials.
Collaborations
Zhenfeng Guo collaborates with Jennie S. Hwang, a respected figure in the field, to further enhance the impact of their research and innovations.
Conclusion
Zhenfeng Guo's contributions to lead-free solder technology exemplify his commitment to innovation and sustainability in electronics. His work not only addresses industry needs but also promotes environmental responsibility.