The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2001
Filed:
Oct. 12, 1999
Applicant:
Inventors:
Jennie S. Hwang, Moreland Hills, OH (US);
Zhenfeng Guo, Solon, OH (US);
Assignee:
H-Technologies Group, Incorporated, Cleveland, OH (US);
Primary Examiner:
Int. Cl.
CPC ...
C22C 7/00 ;
U.S. Cl.
CPC ...
C22C 7/00 ;
Abstract
Disclosed is a high strength, high fatigue resistance, and high wetting lead-free solder alloy comprising effective amounts of tin, copper, silver, bismuth, indium, and antimony and having a melting temperature between 175-215° C.