Zhe Li

Title: Zhe Li: Innovator in Semiconductor Packaging Technology

Introduction

Zhe Li is a prominent inventor based in Tianjin, China, known for his contributions to semiconductor packaging technology. With a total of 2 patents, he has made significant advancements in the field, particularly in methods that enhance the efficiency and reliability of semiconductor devices.

Latest Patents

Zhe Li's latest patents include a method of making a chip-on-lead package and a coated lead frame. The chip-on-lead package patent describes a process for assembling a semiconductor device that involves mounting and sawing a wafer to provide individual semiconductor dies. It includes a first molding operation on a lead frame, followed by the deposition of epoxy via a screen printing process. The die is attached at room temperature, and the epoxy is cured in an oven, which improves throughput by eliminating the need for a hot die attach process. An optional plasma cleaning step enhances wire bonding quality and second molding quality. The coated lead frame patent features a coating of organic compounds on lead fingers, which prevents contamination from tin and flux after die attach. This innovation allows for reliable second bonds and improves wire peel strength.

Career Highlights

Zhe Li is currently employed at Freescale Semiconductor, Inc., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the efficiency and reliability of semiconductor packaging processes.

Collaborations

Zhe Li collaborates with talented coworkers, including Zhijie Wang and Qingchun He, who contribute to the innovative environment at Freescale Semiconductor, Inc.

Conclusion

Zhe Li's contributions to semiconductor packaging technology through his patents and work at Freescale Semiconductor, Inc. highlight his role as a key innovator in the field. His advancements not only improve manufacturing processes but also enhance the overall performance of semiconductor devices.