Shaanxi, China

Zhaoxin Wu

This inventor holds 1 USPTO granted patent. Top assignee: Xi'an Smart Materials Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhaoxin Wu. Retrieved from https://idiyas.com/inventor/zhaoxin-wu-1xihqpf7

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Zhaoxin Wu and Photoelectronic Component Packaging

Introduction

Zhaoxin Wu is an inventor associated with Shaanxi, China, and Xi'an Smart Materials Co., Ltd. His patent work includes a packaging composition designed to improve the durability and performance of photoelectronic components.

Latest Patents

Wu is named on 1 patent: “Composition for Use in Photoelectronic Component Packaging, Packaging Structure, and Photoelectronic Component.” The patent describes a composition containing a photocurable monomer, a monofunctional or trifunctional silicon-containing monomer, and an initiator. The silicon-containing monomer’s Si—O—Si chain segments help disperse stress and reduce internal stress, while also improving the composition’s thermal performance and hydrophobicity. The resulting film packaging is intended to help extend the service life of photoelectronic components.

Career Highlights

Wu’s listed patent reflects work on materials for encapsulating photoelectronic components. The disclosed formulation combines photocurable and silicon-containing monomers to address mechanical stress and environmental durability.

Collaborations

Wu’s listed coworkers include Ting Lei and Lu Li. His patent is associated with Xi'an Smart Materials Co., Ltd.

Conclusion

Zhaoxin Wu’s patent focuses on a silicon-containing encapsulation composition intended to strengthen and protect photoelectronic components, supporting longer-lasting packaging performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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