Composition for use in photoelectronic component packaging, packaging structure, and photoelectronic component

Abstract

Disclosed are a composition for use in photoelectronic component encapsulated, an encapsulation structure and a photoelectronic component. The composition includes 10%~70% of a photocurable monomer; 10%~70% of a monofunctional or trifunctional silicon-containing monomer; and 0.5%~10% of an initiator. The use of the silicon-containing monomer, on the one hand, because of the strong distensibility of Si—O—Si chain segment of self, provides a stress dispersing effect upon impact, reduces internal stress, and increases the mechanical performance of the organic encapsulation composition; and on the other hand, effectively increases the thermal performance and hydrophobicity of the organic encapsulation composition. Film packaging for use in the photoelectronic component may effectively increase the service life of the component.