Shaanxi, China

Lu Li

This inventor holds 1 USPTO granted patent. Top assignee: Xi'an Smart Materials Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lu Li. Retrieved from https://idiyas.com/inventor/lu-li-r2x5o4nk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Lu Li and Photoelectronic Component Packaging Innovation.

Introduction

Lu Li is an inventor associated with Shaanxi, China, and Xi’an Smart Materials Co., Ltd. Her patent work addresses materials and structures for packaging photoelectronic components. The supplied information lists 1 patent.

Latest Patents

Lu Li’s listed patent is “Composition for Use in Photoelectronic Component Packaging, Packaging Structure, and Photoelectronic Component.” It describes a composition containing 10%–70% photocurable monomer, 10%–70% monofunctional or trifunctional silicon-containing monomer, and 0.5%–10% initiator.

The patent explains that silicon-containing monomers can help disperse stress through the flexibility of their Si—O—Si chain segments, reducing internal stress and improving mechanical performance. They can also enhance thermal performance and hydrophobicity. The resulting film packaging is intended to help extend the service life of photoelectronic components.

Career Highlights

The available information connects Lu Li’s patent activity with Xi’an Smart Materials Co., Ltd. Her listed invention focuses on improving the durability and performance of photoelectronic component packaging through material composition and encapsulation design.

Collaborations

The supplied information identifies Zhaoxin Wu and Ting Lei as Lu Li’s coworkers. It does not specify their roles in the patent or describe particular collaborative contributions.

Conclusion

Lu Li’s listed patent presents a silicon-containing packaging composition designed to improve stress management, mechanical properties, thermal performance, and hydrophobicity in photoelectronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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