Hong Kong, China

Zhang Wenqi

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: City University of Hong Kong. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhang Wenqi. Retrieved from https://idiyas.com/inventor/zhang-wenqi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations of Zhang Wenqi in 3D Fabrication Techniques

Introduction

Zhang Wenqi is a prominent inventor based in Hong Kong, China. He has made significant contributions to the field of 3D fabrication, particularly through his innovative methods that utilize rolling-up kirigami techniques. His work has the potential to revolutionize how three-dimensional structures are created from two-dimensional materials.

Latest Patents

Zhang Wenqi holds a patent for "Fabrication methods for 3D structures based on rolling-up kirigami techniques." This patent outlines methods for transforming two-dimensional films into three-dimensional structures. The process involves forming multiple layers of different materials on a substrate and creating a pattern in the top layer. By removing portions of the underlying layers, a three-dimensional structure is achieved, showcasing the versatility and creativity of his approach.

Career Highlights

Zhang Wenqi is affiliated with the City University of Hong Kong, where he continues to advance his research in 3D fabrication technologies. His work has garnered attention for its innovative approach and practical applications in various fields, including engineering and design.

Collaborations

Zhang has collaborated with notable colleagues such as Lixin Dong and Kun Wang. These partnerships have fostered a collaborative environment that enhances the research and development of new technologies in the realm of 3D fabrication.

Conclusion

Zhang Wenqi's contributions to the field of 3D fabrication through his innovative patent demonstrate his commitment to advancing technology. His work not only showcases his inventive spirit but also paves the way for future developments in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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