The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Oct. 03, 2023
Applicant:

City University of Hong Kong, Kowloon, HK;

Inventors:

Lixin Dong, Kowloon, HK;

Kun Wang, Kowloon, HK;

Chaojian Hou, Kowloon, HK;

Zhang Wenqi, Kowloon, HK;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 14/58 (2006.01); C23C 14/02 (2006.01); C23C 14/14 (2006.01); C23C 14/30 (2006.01); C23C 16/34 (2006.01); C23C 16/513 (2006.01); C23C 16/56 (2006.01); C23C 28/00 (2006.01);
U.S. Cl.
CPC ...
C23C 14/5873 (2013.01); C23C 14/028 (2013.01); C23C 14/14 (2013.01); C23C 14/30 (2013.01); C23C 16/345 (2013.01); C23C 16/513 (2013.01); C23C 16/56 (2013.01); C23C 28/32 (2013.01); C23C 28/34 (2013.01);
Abstract

Fabrication methods are provided for transforming two-dimensional films into three-dimensional structures based on rolling-up kirigami techniques. In an example, a method includes forming a first layer of a first material on a portion of a substrate, forming a second layer of a second material on the first layer and a second portion of the substrate, and forming a third layer of a third material on a first portion of the second layer. A pattern is formed into the third layer when forming the third layer. The example method further includes transforming at least a portion of the third layer into a three-dimensional structure based in part on removing a second portion of the second layer and at least a portion of the first layer.


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