Hong Kong, China

Kun Wang

This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: City University of Hong Kong. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kun Wang. Retrieved from https://idiyas.com/inventor/kun-wang-4kyron6e

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Kun Wang: Innovator in 3D Structure Fabrication

Introduction

Kun Wang is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of fabrication methods for three-dimensional structures. His innovative approach utilizes rolling-up kirigami techniques, which have the potential to revolutionize the way 3D structures are created.

Latest Patents

Kun Wang holds a patent for "Fabrication methods for 3D structures based on rolling-up kirigami techniques." This patent outlines methods for transforming two-dimensional films into three-dimensional structures. The process involves forming multiple layers of different materials on a substrate and creating a pattern in the top layer. By removing portions of the underlying layers, a three-dimensional structure is achieved.

Career Highlights

Kun Wang is affiliated with the City University of Hong Kong, where he continues to advance his research and development in innovative fabrication techniques. His work has garnered attention for its practical applications in various fields, including engineering and design.

Collaborations

Kun Wang collaborates with notable colleagues such as Lixin Dong and Chaojian Hou. Their combined expertise enhances the research and development efforts in their respective projects.

Conclusion

Kun Wang's contributions to the field of 3D structure fabrication highlight his innovative spirit and dedication to advancing technology. His work not only showcases his inventiveness but also paves the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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