Granby, Canada

Yvan Bessette


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2015-2016

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2 patents (USPTO):Explore Patents

Title: Yvan Bessette: Innovator in Electronic Component Removal

Introduction

Yvan Bessette is a notable inventor based in Granby, Canada. He has made significant contributions to the field of electronic component removal, holding 2 patents that showcase his innovative approaches.

Latest Patents

Yvan Bessette's latest patents include a "System for removing an electronic component from a substrate" and a "Method for removing an electronic component from a substrate." The first patent describes a system that utilizes a heating device to heat a substrate, where an electronic component, such as a microchip, is attached via solder connections. A thermally conductive picker head is employed to apply tension to the electronic component while drawing heat away, creating a uniform temperature gradient across the solder connections. This process facilitates the removal of the electronic component along with most or all of the solder. The second patent outlines a method that begins with preheating the substrate and applying a thermally conductive picker head to quench the electronic component. Tension is then applied, and the substrate is heated until the solder connections reach their melting point, allowing for the removal of the electronic component and associated solder.

Career Highlights

Yvan Bessette is currently associated with the International Business Machines Corporation (IBM), where he continues to innovate in the field of electronic components. His work has contributed to advancements in the efficiency and effectiveness of electronic component removal techniques.

Collaborations

Yvan has collaborated with notable coworkers, including Eric Bouchard and Nicolas Boyer, who have also contributed to the field of electronic components.

Conclusion

Yvan Bessette's innovative patents and contributions to the field of electronic component removal highlight his expertise and commitment to advancing technology. His work at IBM and collaborations with fellow inventors further emphasize his role as a key player in this industry.

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