The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Apr. 22, 2011
Yvan Bessette, Granby, CA;
Eric Bouchard, Canton de Granby, CA;
Nicolas Boyer, Canton d'Orford, CA;
Camille Dube, Bromont, CA;
Eric Dube, Bromont, CA;
Sarah Turgeon, Shefford, CA;
Yvan Bessette, Granby, CA;
Eric Bouchard, Canton de Granby, CA;
Nicolas Boyer, Canton d'Orford, CA;
Camille Dube, Bromont, CA;
Eric Dube, Bromont, CA;
Sarah Turgeon, Shefford, CA;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A system and method for removing an electronic component from a substrate is described. In one embodiment, a method in accordance with the invention includes initially preheating a substrate, wherein an electronic component (such as a microchip or discrete electronic component) is attached to the substrate by one or more solder connections. A thermally conductive picker head is applied to the electronic component to quench the electronic component and generate a temperature gradient across the solder connections. Tension is applied to the electronic component using the picker head. The substrate is then heated until a melting point is reached at the interface between the substrate and the solder connections. When the melting point is reached, the tension applied by the picker head removes the electronic component from the substrate. Most if not all of the solder associated with the solder connections is removed with the electronic component.