Kirishima, Japan

Yuuna Ookubo

This inventor holds 4 USPTO granted patents and 1 EPO patent. Top assignee: Kyocera Corporation. Active years: 2017-2018.


% Patents Active = 100.0

 

Average Co-Inventor Count = 4.6

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Kyoto, JP (2017)
  • Kirishima, JP (2017 - 2018)

Company Filing History:


Years Active: 2017-2018

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4 patents (USPTO):Explore Patents

Title: Yuuna Ookubo: Innovator in Thermal Technology

Introduction

Yuuna Ookubo is a notable inventor based in Kirishima, Japan. He has made significant contributions to the field of thermal technology, particularly in the development of thermal heads and printers. With a total of 4 patents to his name, Ookubo continues to push the boundaries of innovation in his field.

Latest Patents

Among his latest patents, one describes a thermal head that includes a substrate, a plurality of heating elements, and electrodes that are electrically connected to these heating elements. The design features a connector with multiple pins and a housing that contains these pins, ensuring efficient functionality. Another patent focuses on a thermal head that incorporates a heat-generating section and a unique connector design, which includes a movable pin that holds the substrate in place. This innovative approach enhances the performance and reliability of thermal printers.

Career Highlights

Yuuna Ookubo is currently employed at Kyocera Corporation, where he applies his expertise in thermal technology. His work has been instrumental in advancing the capabilities of thermal printing solutions, making them more efficient and effective for various applications.

Collaborations

Throughout his career, Ookubo has collaborated with talented individuals such as Youichi Moto and Yui Tanaka. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Yuuna Ookubo's contributions to thermal technology exemplify the spirit of innovation. His patents and collaborations reflect a commitment to advancing the field and improving the functionality of thermal printing solutions.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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