The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Nov. 27, 2014
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Yuuna Ookubo, Kyoto, JP;

Yasumitsu Yamamoto, Kyoto, JP;

Masafumi Hirayama, Kyoto, JP;

Shouji Hirose, Kyoto, JP;

Takumi Hatanaka, Kyoto, JP;

Hisatoshi Takada, Kyoto, JP;

Youichi Moto, Kyoto, JP;

Yui Tanaka, Kyoto, JP;

Yousuke Iwamoto, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/335 (2006.01); B41J 2/345 (2006.01);
U.S. Cl.
CPC ...
B41J 2/3351 (2013.01); B41J 2/3352 (2013.01); B41J 2/3354 (2013.01); B41J 2/3357 (2013.01); B41J 2/345 (2013.01);
Abstract

A thermal head capable of reducing a possibility of separation of a connector is provided. A thermal head includes a substrate; a plurality of heat generating portions disposed on the substrate; a plurality of electrodes which are disposed on the substrate and are electrically connected to the plurality of heat generating portions, respectively; and a connector including a plurality of connector pins which pinch the substrate and are electrically connected to the plurality of electrodes, respectively, and a housing for containing the plurality of connector pins. The housing is disposed adjacent to the substrate in a sub-scanning direction, and the housing includes a support portion disposed under the substrate. This can reduce a possibility of separation of the connector.


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