Yusuke Horiguchi

Title: Yusuke Horiguchi: Patent Inventor in Electronic Device Packaging.

Introduction

Yusuke Horiguchi is an inventor associated with Skyworks Solutions, Inc. and based in Osaka, Japan. His patent work concerns electronic device packaging and the routing of electrical connections within a compact package.

Latest Patents

The provided information lists one patent associated with Horiguchi: “Bulk Acoustic Wave Device Packaging with Redistribution Using Silicon Dioxide Insulation.” The patent describes an electronic device mounted on a base substrate and covered by a cap substrate, with a conductive column connecting the substrates. A through-substrate via connects the column to a redistribution layer, while a contact pad is positioned horizontally away from the via. A silicon dioxide insulation layer supports the redistribution structure. This arrangement enables electrical connections to be routed within the package.

Career Highlights

Horiguchi’s listed patent reflects work on packaging technology for electronic devices, including bulk acoustic wave components. His recorded portfolio includes 1 patent.

Collaborations

The patent information associates Horiguchi with Skyworks Solutions, Inc. The supplied details do not identify additional collaborators or describe his specific role at the company.

Conclusion

Yusuke Horiguchi’s documented invention focuses on substrate-based electronic packaging and redistributed electrical connections, representing his listed contribution to patent innovation.