The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Oct. 05, 2022
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Atsushi Takano, Kadoma, JP;

Mitsuhiro Furukawa, Nishinomiya, JP;

Yusuke Horiguchi, Osaka, JP;

Assignee:

SKYWORKS SOLUTIONS, INC., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 3/007 (2006.01); H03H 9/15 (2006.01); H03H 9/24 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02244 (2013.01); H03H 3/0072 (2013.01); H03H 9/15 (2013.01); H03H 9/2405 (2013.01);
Abstract

An electronic device package comprises an electrical device disposed on a base substrate, a conductive column in electrical communication with the electrical device and having a first end bonded to the base substrate, a cap substrate disposed over the electrical device and bonded to a second end of the conductive column, a layer of dielectric material disposed on the lower surface of the base substrate, a through substrate via in electrical communication with the conductive column and passing through the base substrate and the layer of dielectric material, a redistribution layer disposed on the layer of dielectric material, and a contact pad formed on the redistribution layer and in electrical communication with the through substrate via through the redistribution layer, the contact pad being horizontally displaced from a position directly below the through substrate via.


Find Patent Forward Citations

Takano, Atsushi. (2026). Bulk acoustic wave device packaging with redistribution using silicon dioxide insulation (U.S. Patent No. 12719440). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12719440

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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