Yusuke Haruna

Title: Yusuke Haruna: Innovator in Shield Technology

Introduction

Yusuke Haruna is a notable inventor based in Higashiosaka, Japan. He has made significant contributions to the field of electrical engineering, particularly in the development of shield technology for printed wiring boards.

Latest Patents

Haruna holds a patent for a shield film and shield printed wiring board. This innovation provides a shield film that exhibits excellent shielding characteristics in the high-frequency region. The shield film is designed to be applied on a flexible printed wiring board, which includes a base film with a signal circuit formed on it. An insulating film covers the entire upper surface of the base film, ensuring that the signal circuit is protected. The shield film features an electroconductive adhesive layer that is applied throughout the surface of the insulating film, along with a metal layer that covers the electroconductive adhesive layer.

Career Highlights

Yusuke Haruna is currently employed at Tatsuta Electric Wire & Cable Co., Ltd. His work at this company has allowed him to focus on innovations that enhance the performance and reliability of electrical components.

Collaborations

Haruna has collaborated with notable colleagues, including Sirou Yamauchi and Hiroshi Tajima. These partnerships have contributed to the advancement of technology in their field.

Conclusion

Yusuke Haruna's contributions to shield technology demonstrate his commitment to innovation in electrical engineering. His patent for a shield film and printed wiring board highlights his expertise and the impact of his work in the industry.