The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Jun. 05, 2013
Applicant:

Tatsuta Electric Wire & Cable Co., Ltd., Higashiosaka-shi, Osaka, JP;

Inventors:

Yusuke Haruna, Higashiosaka, JP;

Sirou Yamauchi, Higashiosaka, JP;

Hiroshi Tajima, Higashiosaka, JP;

Kenji Kamino, Higashiosaka, JP;

Assignee:

TATSUTA ELECTRIC WIRE & CABLE CO., LTD, Higashiosaka-shi, Osaka, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/02 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0088 (2013.01); B32B 7/12 (2013.01); B32B 15/04 (2013.01); B32B 15/20 (2013.01); H05K 1/0215 (2013.01); H05K 1/0216 (2013.01); H05K 1/0218 (2013.01); H05K 1/0296 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2457/00 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0707 (2013.01); H05K 2201/0715 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01);
Abstract

Provided are: a shield film having excellent shield characteristics in the high frequency region of the shield film; and a shield printed wiring board. A shield film () is provided on a flexible printed wiring board (), which has a base film () having a signal circuit (a) formed thereon, and an insulating film () that is provided on the whole upper surface of the base film () such that the insulating film covers the signal circuit (). The shield filmhas an electroconductive adhesive layerprovided throughout a surface of the insulating film, and a metal layerprovided throughout a surface of the electroconductive adhesive layer


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