Mie, Japan

Yusuke Dohmae

This inventor holds 2 USPTO granted patents. Top assignee: Kabushiki Kaisha Toshiba. Active years: 2013-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yusuke Dohmae. Retrieved from https://idiyas.com/inventor/yusuke-dohmae-3goi67km

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 1.8

ph-index = 1

Forward Citations = 23(Granted Patents)


Location History:

  • Yokkaichi, JP (2013)
  • Mie-gun, JP (2014)

Company Filing History:


Years Active: 2013-2014

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2 patents (USPTO):Explore Patents

Title: Yusuke Dohmae: Innovator in Semiconductor Technology

Introduction

Yusuke Dohmae is a prominent inventor based in Mie-gun, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative methods and devices that enhance the efficiency and functionality of semiconductor components.

Latest Patents

Dohmae's latest patents include a semiconductor device and a method for manufacturing the same. In one embodiment, the semiconductor device features a first semiconductor chip mounted on a circuit board, secured by an adhesive layer. This adhesive layer not only fixes the first chip but also accommodates a second semiconductor chip, which is smaller in size. The design allows for part of the second chip to be embedded within the adhesive layer, which has a specific thickness ranging from 95 to 150 µm. The adhesive layer is composed of a cured thermosetting resin, optimized for thermal time viscosity during the embedding process.

The manufacturing method of the semiconductor device involves several steps. It begins with forming grooves on the semiconductor wafer's first surface. After attaching a protection sheet, the wafer is ground from the second surface to separate it into individual chip areas. A laminated film, consisting of a dicing film and an adhesive film, is then affixed to the second surface before cutting the adhesive film to finalize the process.

Career Highlights

Yusuke Dohmae is associated with Kabushiki Kaisha Toshiba, a leading company in the technology sector. His work at Toshiba has allowed him to push the boundaries of semiconductor innovation, contributing to advancements that are crucial for modern electronics.

Collaborations

Dohmae has collaborated with notable colleagues, including Naoki Iwamasa and Masatoshi Kawato. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor field.

Conclusion

Yusuke Dohmae's contributions to semiconductor technology through his patents and work at Toshiba highlight his role as an influential inventor. His innovative approaches continue to shape the future of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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