The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Mar. 12, 2013
Kabushiki Kaisha Toshiba, Tokyo, JP;
Akira Tanimoto, Yokohama, JP;
Takashi Imoto, Yokkaichi, JP;
Yoriyasu Ando, Yokkaichi, JP;
Masashi Noda, Ichinomiya, JP;
Naoki Iwamasa, Yokkaichi, JP;
Koichi Miyashita, Yokkaichi, JP;
Masatoshi Kawato, Kameyama, JP;
Masaji Iwamoto, Yokohama, JP;
Jun Tanaka, Yokkaichi, JP;
Yusuke Dohmae, Mie-gun, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
In one embodiment, a semiconductor device includes a first semiconductor chip disposed on a circuit board, an adhesive layer fixing the first semiconductor chip to the circuit board, and a second semiconductor chip having an outer shape smaller than that of the first semiconductor chip. At least a part of the second semiconductor chip is embedded in the adhesive layer. The adhesive layer has a thickness in a range of 95 to 150 μm. The adhesive layer includes a cured product of a thermosetting resin whose thermal time viscosity at a time that the second semiconductor chip is embedded is in a range of 500 to 5000 Pa·s.