Shenzhen, China

Yuping Liu

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 2.7

ph-index = 1


Location History:

  • Guangdong, CN (2021)
  • Shenzhen, CN (2018 - 2022)

Company Filing History:


Years Active: 2018-2022

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4 patents (USPTO):Explore Patents

Title: Innovations of Yuping Liu in Fingerprint Detection and Semiconductor Packaging

Introduction

Yuping Liu is a notable inventor based in Shenzhen, China. He has made significant contributions to the fields of fingerprint detection and semiconductor packaging technologies. With a total of four patents to his name, Liu continues to push the boundaries of innovation in his industry.

Latest Patents

Yuping Liu's latest patents include a fingerprint detection apparatus and an electronic device. This fingerprint detection apparatus is designed to be applied under a display screen. It features a plurality of fingerprint detecting units that are either distributed in an array or arranged in a staggered manner. Each fingerprint detecting unit consists of multiple optical sensing pixels, at least one micro lens positioned above these pixels, and at least one light shielding layer placed between the micro lens and the optical sensing pixels. The design allows oblique light signals from multiple directions to be transmitted to the optical sensing pixels through openings in the light shielding layer after being converged by the micro lens.

Another significant patent is the secondary packaging method and secondary package of a through silicon via (TSV) chip. This method is crucial in semiconductor packaging technologies. The TSV chip has a forward surface and a counter surface that are opposite to each other. A BGA solder ball is placed on the counter surface. The secondary packaging method involves placing at least one TSV chip on a base with a stress relief film layer, cladding the chip with a softened molding compound, and processing the surface of the secondary package to expose the BGA solder ball after curing.

Career Highlights

Yuping Liu is currently employed at Shenzhen Goodix Technology Co., Ltd. His work at this company has allowed him to develop innovative solutions that enhance the functionality and efficiency of electronic devices. Liu's expertise in fingerprint detection and semiconductor packaging has positioned him as a key player in the technology sector.

Collaborations

Yuping Liu collaborates with talented individuals such as Wei Long and Baoquan Wu. These partnerships foster a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Yuping Liu's contributions to fingerprint detection and semiconductor packaging exemplify the spirit of innovation. His patents reflect a commitment to advancing technology and improving user experiences in electronic devices. Liu's work continues to inspire future developments in these critical fields.

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