The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Jun. 01, 2017
Shenzhen Goodix Technology Co., Ltd., Shenzhen, CN;
Yuping Liu, Shenzhen, CN;
Wei Long, Shenzhen, CN;
Shenzhen Goodix Technology Co., Ltd., Shenzhen, CN;
Abstract
A sensor chip package assembly and an electronic device having the sensor chip package assembly are disclosed, where the sensor chip package assembly includes: a metal substrate () which has a bonding pad region () and a placement region (), the bonding pad region having a plurality of metal bonding pads (); a sensor chip () which is located on an upper surface of the metal substrate, and the sensor chip having a plurality of sensor chip bonding pads (); an electrical connection assembly () which electrically connects a metal bonding pad and a sensor chip bonding pad; and a packaging material cover () which covers the metal substrate, the sensor chip and the electrical connection assembly, where any two adjacent metal bonding pads are spaced in an insulated manner by the packaging material cover.