Shanghai, China

Yuntao Jiang

This inventor holds 2 USPTO granted patents and 2 published patent applications and 3 EPO patents. Top assignee: Semiconductor Manufacturing International (Shanghai) Corporation. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yuntao Jiang. Retrieved from https://idiyas.com/inventor/yuntao-jiang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.4

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018

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2 patents (USPTO):Explore Patents

Title: Yuntao Jiang: Innovator in Chemical Mechanical Polishing and Aerial Imaging

Introduction

Yuntao Jiang is a prominent inventor based in Shanghai, China. He has made significant contributions to the fields of chemical mechanical polishing and aerial imaging. With a total of 2 patents, Jiang's work showcases his expertise and innovative spirit.

Latest Patents

Jiang's latest patents include a Chemical Mechanical Polishing (CMP) apparatus and method. This apparatus features a polishing zone with a wafer entrance and exit, a first wafer platform, a polishing module, a slurry injection module, a polishing cleaning module, and a film-thickness measuring module. The first wafer platform is designed to move from the wafer entrance to the wafer exit along a specified direction. The polishing module, located in the polishing zone, includes a polishing belt that moves in a direction perpendicular to the first. The slurry injection module is responsible for injecting slurry towards the wafer to be polished, while the polishing cleaning module cleans the wafer. Additionally, the film-thickness measuring module measures the thickness of the wafer.

Another notable patent is the system and method for measuring an aerial image. This system includes a lighting unit that provides illuminating light to pass through a mask, forming initial light. An imaging unit captures this initial light to create imaging light. A beam splitting unit divides the imaging light into projection and reference light. The projection light is directed onto a substrate to form a mask image, which reflects the light to create first reflected light. A reflecting unit receives the reference light to form second reflected light, which interferes with the first reflected light to create interference light. A measuring unit then measures the aerial image formed from this interference light.

Career Highlights

Yuntao Jiang has worked with notable companies such as Semiconductor Manufacturing International Corporation and Hengdian Group Dmegc Magnetics Co., Ltd. His experience in these organizations has contributed to his development as an inventor and innovator in his field.

Collaborations

Jiang has collaborated with talented individuals, including Jun Yang and Ken Wu. Their teamwork has likely fostered innovative ideas and advancements in their respective projects.

Conclusion

Yuntao Jiang's contributions to chemical mechanical polishing and aerial imaging highlight his innovative capabilities and dedication to advancing technology. His patents reflect a commitment to improving processes and systems in the semiconductor industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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