Yunkyeong Jeong

Title: Yunkyeong Jeong - Innovator in Semiconductor Technology

Introduction

Yunkyeong Jeong is an inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.

Latest Patent Applications

Yunkyeong Jeong's recent patent applications include two notable inventions. The first is titled "SEMICONDUCTOR PACKAGE AND METHOD OF IMPLEMENTING REDISTRIBUTION LAYER IN BALL GRID ARRAY." This semiconductor package features a plurality of first semiconductor chips stacked vertically and interconnected through first through electrodes. It also includes a second semiconductor chip positioned beneath the first chips, connected via second through electrodes. The design incorporates a redistribution layer that enhances the functionality of the semiconductor package.

The second application is for a "MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME." This memory device consists of a first core die, a second core die, and a base die stacked in a specific direction. The base die is designed to output data from memory cells provided by the core dies through a through-via, which passes through both core dies with varying burst lengths based on a mode signal.

Conclusion

Yunkyeong Jeong's work in semiconductor technology showcases his innovative spirit and potential for future contributions to the field. His latest patent applications reflect a commitment to advancing technology in memory devices and semiconductor packaging.