This inventor holds 1 USPTO granted patent. Top assignee: Visera Technologies Company Limited. Active years: 2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015
Title: Yung-Shun Liao: Innovator in Wafer Level Packaging
Introduction
Yung-Shun Liao is a notable inventor based in Yunlin, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in wafer level packaging. His innovative approach has led to the development of a unique patent that enhances the efficiency and functionality of semiconductor devices.
Latest Patents
Liao holds a patent for a "Wafer level package and mask for fabricating the same." This exemplary wafer level package comprises a semiconductor wafer with a plurality of semiconductor chips of perfect polygonal shapes. A circuit-free area is defined over the semiconductor wafer to electrically isolate the semiconductor chips. A dam structure is substantially formed over the circuit-free area, wherein a portion of the dam structure formed around an edge of the semiconductor wafer is created with a plurality of via holes. Additionally, a transparent substrate is formed over the semiconductor wafer, defining a plurality of cavities between the semiconductor chips and the transparent substrate, with the transparent substrate being supported by the dam structure. This innovation represents a significant advancement in the field.
Career Highlights
Yung-Shun Liao is currently associated with Visera Technologies Company Limited, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing solutions that address the challenges faced in the industry. Liao's dedication to innovation has earned him recognition among his peers.
Collaborations
Liao has collaborated with several talented individuals in his field, including Fu-Tien Weng and Yi-Chuan Lo. These collaborations have fostered an environment of creativity and innovation, leading to advancements in semiconductor packaging technologies.
Conclusion
Yung-Shun Liao is a prominent figure in the semiconductor industry, known for his innovative contributions to wafer level packaging. His patent and ongoing work at Visera Technologies Company Limited highlight his commitment to advancing technology in this critical field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile