Hsinchu, Taiwan

Yung-Chun Wen


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Yung-Chun Wen: Advancing Semiconductor Technology

Introduction

Yung-Chun Wen, an inventor based in Hsinchu, Taiwan, has made a significant impact in the field of semiconductor technology. His innovative work at United Microelectronics Corporation has led to the development of a unique method that enhances the uniformity of wafer-to-wafer film thickness. This contribution is crucial for the precision demanded in semiconductor manufacturing.

Latest Patents

Yung-Chun Wen holds a patent titled "Method for improving the uniformity of wafer-to-wafer film thickness." This patent outlines a systematic approach where shower heads in a Plasma-Enhanced Chemical Vapor Deposition (PECVD) system are preheated to ensure stable temperatures during film deposition. By maintaining consistent temperatures during the process, the invention effectively resolves the issue of uneven film thickness across different wafers. Furthermore, the method suggests that simultaneous heating of the shower heads and the heater block can optimize the operational efficiency following maintenance procedures.

Career Highlights

Wen's work at United Microelectronics Corporation exemplifies his dedication to advancing technology in semiconductor manufacturing. His ability to devise solutions that improve production processes sets him apart as a leading inventor in his field. The successful implementation of his patented method signifies a leap toward achieving higher quality standards in thin film applications.

Collaborations

Throughout his career, Yung-Chun Wen has collaborated with notable colleagues, including Tsung-Lin Lu and Ping-Chung Chung. Together, their combined expertise contributes to innovation within the semiconductor industry, fostering an environment of teamwork and creativity.

Conclusion

Yung-Chun Wen is a noteworthy figure in the realm of semiconductor innovation. With his single, yet impactful patent, he has laid the groundwork for improvements in wafer film thickness consistency. His contributions at United Microelectronics Corporation, along with strong collaborations, highlight the significance of inventive minds in pushing technological boundaries.

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