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For the Inventor, By the Inventor

Tianjin, China

Yunfang Bai

This inventor holds 18 USPTO granted patents and 8 published patent applications and 4 EPO patents, primarily in Radio Frequency Amplifiers. Top assignees: Vanchip (Tianjin) Technology Co., Ltd., Vanchip (Tianjin) Technology Co., Ltd.. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yunfang Bai. Retrieved from https://idiyas.com/inventor/yunfang-bai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 83.3

 

Average Co-Inventor Count = 1.7

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:

goldMedal15 out of 28 
 
Vanchip (Tianjin) Technology Co., Ltd.
 patents
silverMedal3 out of 4 
 
Vanchip (Tianjin) Technology Co., Ltd.
 patents

Years Active: 2017-2026

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Areas of Expertise:
Radio Frequency Amplifier
Communication Terminal
Power Detection Circuit
Electromagnetic Shielding
Hybrid Coupler
Transistor Performance
Power Amplifier Module
Temperature Compensation
Anti-Electromagnetic Interference
Voltage Equalization
Multimode Power Amplifier
18 patents (USPTO):Explore Patents
1. 12665555 - Radio frequency power amplifier that reduces load change sensitivity, chip, and communication terminal (2026-06-23),
2. 12638482 - Power detection circuit having temperature compensation function, and radio-frequency front-end module comprising power detection circuit (2026-05-26),
3. 12616032 - Electromagnetic shielding structure, manufacturing method, and communication terminal (2026-04-28),
4. 12519428 - Radio frequency power amplifier, radio frequency front-end module, and communication terminal (2026-01-06),
5. 12463597 - Radio-frequency power amplifier, radio-frequency front-end module and communication terminal (2025-11-04),
6. 12362452 - 3 DB orthogonal hybrid coupler, radio-frequency front-end module and communication terminal (2025-07-15),
7. 12255590 - Radio frequency power amplifier, chip, and communication terminal (2025-03-18),
8. 11442888 - Serial communication apparatus for unidirectional communication between chips of radio frequency front-end module and inside the chips (2022-09-13),
9. 11323074 - Radio frequency power amplifier based on power detection feedback, chip and communication terminal (2022-05-03),
10. 11302625 - Radio frequency transistor for improving radio frequency switch performance, chip and mobile terminal (2022-04-12),
11. 11277165 - Radio frequency front-end transmission module, chip, and communications terminal (2022-03-15),
12. 11264335 - Anti-electromagnetic interference radio frequency module and implementation method therefor (2022-03-01),
13. 11177781 - Radio frequency power amplifier based on current detection feedback, chip and communication terminal (2021-11-16),
14. 11146259 - Voltage equalization method for use in radiofrequency switch having multiple transistors connected in series and radiofrequency switch (2021-10-12),
15. 11133786 - Radio frequency power amplifier module having high linearity and power-added efficiency and implementation method (2021-09-28),

Title: Inventor Yunfang Bai - Revolutionizing Technology in Tianjin

Introduction: Yunfang Bai is a visionary inventor based in Tianjin, China, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Bai's recent patents focus on advancements in artificial intelligence algorithms for autonomous vehicles, smart city infrastructure, and renewable energy systems.

Career Highlights: With over two decades of experience in research and development, Bai has held key positions in leading tech companies, driving forward cutting-edge projects and spearheading innovative solutions.

Collaborations: Bai has collaborated with top research institutions and universities worldwide, fostering a culture of knowledge exchange and pushing the boundaries of technological possibilities.

Conclusion: Yunfang Bai's relentless pursuit of innovation continues to shape the landscape of technology in Tianjin and beyond, solidifying his reputation as a trailblazing inventor in the digital age.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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