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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12616032 B1

PDFFull Text
Date of Patent:
Apr. 28, 2026

Filed:

Jan. 18, 2024

Electromagnetic shielding structure, manufacturing method, and communication terminal

Applicant:

Vanchip (Tianjin) Technology Co., Ltd., Tianjin, CN;

Inventors:

Ying Yu, Tianjin, CN;

Yunfang Bai, Tianjin, CN;

Assignee:

VANCHIP (TIANJIN) TECHNOLOGY CO., LTD., Tianjin, CN;

Attorneys:

George Guosheng Wang

Upstream Research and Patent LLC

Primary Examiner:

Rockshana D Chowdhury

Assistant Examiner:

Martin Antonio Asmat Uceda

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4853 (2013.01); H01L 21/486 (2013.01); H01L 21/565 (2013.01); H01L 23/293 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 25/0655 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6616 (2013.01);
Abstract

Disclosed in the present invention are an electromagnetic shielding structure, a manufacturing method and a communication terminal. The electromagnetic shielding structure comprises a module substrate, which is formed with a plurality of grounding holes penetrating through the module substrate, and the plurality of grounding holes jointly define a mounting area; a device to be shielded, which is attached to the module substrate and located in the mounting area; a plurality of grounding bonding pads, which are respectively arranged in the grounding holes in a penetrating manner; and a plurality of wires, wherein the two ends of each wire are respectively connected to two different grounding bonding pads, such that the plurality of wires jointly form a shielding layer erected above the device to be shielded.

Find Patent Forward Citations

Yu, Ying. (2026). Electromagnetic shielding structure, manufacturing method, and communication terminal (U.S. Patent No. 12616032). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12616032

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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